Scientists have found a replacement for imported materials in the production of printed circuit boards.
Researchers from the Moscow Aviation Institute (MAI) have developed a domestic solution intended for use in the production of printed circuit boards for electronic devices, replacing foreign counterparts that have exited the market. According to the university’s press service, the new solution proves to be more efficient and cost-effective compared to imported offerings.
Fyodor Barakovsky, a lecturer in the MAI Institute of Control Systems, Informatics, and Electric Power Engineering, emphasized that the metallization of a printed circuit board requires activation with a special conductive layer. The process of creating printed circuit boards has become more accessible due to the development of an innovative activation agent by the scientists at the Moscow Aviation Institute.
“The special conductive layer developed by our institute not only replaces imported analogs during the metallization stage but also demonstrates excellent characteristics, sometimes surpassing foreign counterparts. This new development will aid in the production of electronic devices – at the initial stage of implementation, the solution will be beneficial for small-scale and individual production of electronic devices. Later, after completing the project, the obtained results can be successfully applied to large manufacturing plants. Such an approach will allow our development to capture a significant market share and contribute to the development of domestic electronics,” commented Fyodor Barakovsky, a graduate student at the Institute of Control Systems, Informatics, and Electric Power Engineering at MAI.
The novelty is an ammonia solution applied to the printed circuit board by immersion. This composition is over 40 times cheaper than traditional palladium, and it is also simple to manufacture and maintain. The research team is currently exploring alternative methods of applying the solution and studying its aging process and the possibilities of improving adhesion to the surface of the printed circuit board to bring the development to industrial use.
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